Non-UV Dicing Tapes Market: Trends, Growth Trajectory, and Forecasts to 2035
Overview:
The global non-UV dicing tapes market is poised for steady growth between 2025 and 2035. The market is anticipated to expand, driven by the continuous demand in semiconductor manufacturing. In 2025, the market is projected to reach a valuation of USD 1,786.5 million, reflecting the crucial role of these tapes in the fabrication process.
Revenue forecasts indicate a climb to USD 3,051.6 million by 2035, demonstrating a sustained need for non-UV dicing tapes. This growth is underpinned by the increasing complexity of semiconductor devices and the corresponding need for precise and reliable dicing solutions.
The compound annual growth rate (CAGR) from 2025 to 2035 is estimated at 5.5%. This expansion is attributed to technological advancements and the growing semiconductor industry worldwide.
The market’s base year for estimation is 2024, incorporating historical data from 2020 to 2024 to establish reliable forecasts. The forecast period spans from 2025 to 2035, providing a comprehensive outlook on market evolution.
Quantitative units for market analysis include revenue in USD million and CAGR percentages, offering clear metrics for understanding market performance. Report coverage encompasses revenue forecasts, competitive landscapes, growth factors, and prevailing trends.
Key segments include material type and semiconductor applications, providing insights into specific market dynamics. The regional scope includes North America, Europe, and Asia Pacific, with a country-level analysis focusing on the U.S., UK, Germany, Japan, and South Korea.
Key companies analyzed include Nitto Denko Corporation, Lintec Corporation, Furukawa Electric Co., Ltd., Denka Company Limited, and Sumitomo Bakelite Co., Ltd. These firms represent significant players shaping market innovation and competition.
Year On Year Growth Chart
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| Report Attribute | Details |
|---|---|
| Market Size in 2025 | USD 1,786.5 million |
| Revenue Forecast for 2035 | USD 3,051.6 million |
| Growth Rate (CAGR) | 5.5% from 2025 to 2035 |
| Base Year for Estimation | 2024 |
| Historical Data | 2020 – 2024 |
| Forecast Period | 2025 – 2035 |
| Quantitative Units | Revenue in USD million and CAGR from 2025 to 2035 |
| Report Coverage | Revenue forecast, market share, competitive landscape, growth factors, and trends |
| Covered Segments | Material type, and semiconductor applications |
| Regional Scope | North America, Europe, Asia Pacific |
| Country Scope | U.S., UK, Germany, Japan, South Korea |
| Key Companies Analyzed | Nitto Denko Corporation; Lintec Corporation; Furukawa Electric Co., Ltd.; Denka Company Limited; Sumitomo Bakelite Co., Ltd. |
| Customization Options | Free report customization (up to 8 analysts working days) with purchase. Changes to country, regional, and segment scope |
| Pricing and Purchase Options | Customizable purchase options for tailored research needs |
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Key Companies Market Share
Report Coverage & Deliverables
- Market Trends And Dynamics
- Competitve Benchmarking
- Historical data and forecasts
- Value/Volume analysis
- Company revenue shares and key strategies
- Regional opportunities
This is an indicative segmentation. Please request a sample report to see detail segmentation of this market.
Detailed Market Segmentation
- By Material Type
- PVC (Polyvinyl Chloride)
- PET (Polyethylene Terephthalate)
- PO (Polyolefin)
- EVA (Ethylene-Vinyl Acetate)
- By Application
- Wafer Dicing
- Semiconductor Packaging
- Die Attachment
- Other Semiconductor Processes
- By Region
- North America (U.S., Canada)
- Europe (Germany, UK, France, Italy, Rest of Europe)
- Asia Pacific (China, Japan, South Korea, Taiwan, Rest of Asia Pacific)
Table of Content
- Executive Summary
- Market Overview
- Key Market Trends
- Market Dynamics
- Global Market Size and Forecast
- Market Segmentation by Material Type
- PVC Analysis and Forecast
- PET Analysis and Forecast
- PO Analysis and Forecast
- EVA Analysis and Forecast
- Market Segmentation by Application
- Wafer Dicing Analysis and Forecast
- Semiconductor Packaging Analysis and Forecast
- Die Attachment Analysis and Forecast
- Other Applications Analysis and Forecast
- Regional Market Analysis
- North America Market Analysis
- Europe Market Analysis
- Asia Pacific Market Analysis
- Country-Level Analysis
- U.S. Market Analysis
- UK Market Analysis
- Germany Market Analysis
- Japan Market Analysis
- South Korea Market Analysis
- Competitive Landscape
- Major Company Profiles
- Nitto Denko Corporation
- Lintec Corporation
- Furukawa Electric Co., Ltd.
- Denka Company Limited
- Sumitomo Bakelite Co., Ltd.
- Market Opportunities and Future Trends
- Conclusions and Recommendations
- Research Methodology